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El-Bacha A., Sarkis R..  2016.  Design of tilted taper slot antenna for 5G base station antenna circular array. 2016 IEEE Middle East Conference on Antennas and Propagation (MECAP). :1-4.
Eid E, Lacrevaz T., Bermond C., De Rivaz S., Capraro S., Roullard J., Cadix L., Fléchet B., Farcy A., Ancey P. et al..  2010.  Characterization and Modelling of Substrate Coupling Effects in 3D Integrated Circuit Stacking. {Materials for Advanced Metallization}.
Eid E, Lacrevaz T., Houzet G., Bermond C., ARTILLAN P., Fléchet B..  2013.  {Impact des effets de couplage par les substrats sur l'intégrité de signaux numériques rapides dans les empilements 3D de circuits intégrés}. {8e Journées Franco-Maghrébines des Microondes et Applications}.
Eid E, Lacrevaz T., Bermond C., De Rivaz S., Capraro S., Roullard J., Cadix L., Fléchet B., Farcy A., Ancey P. et al..  2010.  Characterization and modeling of RF substrate coupling effects due to vertical interconnects in 3D integrated circuit stacking. Signal Propagation on Interconnects (SPI), 2010 IEEE 14th Workshop on.
Eid E, Lacrevaz T., Bermond C., Capraro S., Roullard J., Fléchet B., Cadix L., Farcy A., Ancey P., Calmon F. et al..  2010.  Frequency and time domain characterization of substrate coupling effects in 3D integration stack. Electronic Manufacturing Technology Symposium (IEMT), 2010 34th IEEE/CPMT International.
Eid E, Lacrevaz T., Houzet G., Bermond C., Fléchet B., Farcy A., Calmon F., Leduc P..  2012.  Effects of silicon substrate coupling phenomena on signal integrity for RF or high speed communications in 3D-IC. Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd.