Export 1 results:
[ Author(Desc)] Title Type Year
Filters: Keyword is Predictive models  [Clear All Filters]
A B C D E F G H I J K L M N O P Q R S T U V W X Y Z 
E
Eid E, Lacrevaz T., Bermond C., De Rivaz S., Capraro S., Roullard J., Cadix L., Fléchet B., Farcy A., Ancey P. et al..  2010.  Characterization and modeling of RF substrate coupling effects due to vertical interconnects in 3D integrated circuit stacking. Signal Propagation on Interconnects (SPI), 2010 IEEE 14th Workshop on.