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Eid E, Lacrevaz T., Bermond C., Capraro S., Roullard J., Fléchet B., Cadix L., Farcy A., Ancey P., Calmon F. et al..  2010.  Frequency and time domain characterization of substrate coupling effects in 3D integration stack. Electronic Manufacturing Technology Symposium (IEMT), 2010 34th IEEE/CPMT International.