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Author Title Type [ Year(Asc)]
Filters: Keyword is Through-silicon vias  [Clear All Filters]
2012
Eid E, Lacrevaz T., Houzet G., Bermond C., Fléchet B., Farcy A., Calmon F., Leduc P..  2012.  Effects of silicon substrate coupling phenomena on signal integrity for RF or high speed communications in 3D-IC. Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd.
2010
Eid E, Lacrevaz T., Bermond C., De Rivaz S., Capraro S., Roullard J., Cadix L., Fléchet B., Farcy A., Ancey P. et al..  2010.  Characterization and modeling of RF substrate coupling effects due to vertical interconnects in 3D integrated circuit stacking. Signal Propagation on Interconnects (SPI), 2010 IEEE 14th Workshop on.
Eid E, Lacrevaz T., Bermond C., Capraro S., Roullard J., Fléchet B., Cadix L., Farcy A., Ancey P., Calmon F. et al..  2010.  Frequency and time domain characterization of substrate coupling effects in 3D integration stack. Electronic Manufacturing Technology Symposium (IEMT), 2010 34th IEEE/CPMT International.