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Author Title Type [ Year(Asc)]
Filters: Keyword is Substrates  [Clear All Filters]
2012
Eid E, Lacrevaz T., Houzet G., Bermond C., Fléchet B., Farcy A., Calmon F., Leduc P..  2012.  Effects of silicon substrate coupling phenomena on signal integrity for RF or high speed communications in 3D-IC. Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd.
2010
Eid E, Lacrevaz T., Bermond C., Capraro S., Roullard J., Fléchet B., Cadix L., Farcy A., Ancey P., Calmon F. et al..  2010.  Frequency and time domain characterization of substrate coupling effects in 3D integration stack. Electronic Manufacturing Technology Symposium (IEMT), 2010 34th IEEE/CPMT International.