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Author Title Type [ Year(Asc)]
Filters: Author is Elie Eid  [Clear All Filters]
2015
Asmar JAL, Kouta R, Chaccour K, Assad JEL, Laghrouche S, Eid E, Wack M.  2015.  Power Generation and Cogeneration Management Algorithm with Renewable Energy Integration. Energy Procedia. 74:1394–1401.
2013
Eid E, Lacrevaz T., Houzet G., Bermond C., ARTILLAN P., Fléchet B..  2013.  {Impact des effets de couplage par les substrats sur l'intégrité de signaux numériques rapides dans les empilements 3D de circuits intégrés}. {8e Journées Franco-Maghrébines des Microondes et Applications}.
2012
Eid E, Lacrevaz T., Houzet G., Bermond C., Fléchet B., Farcy A., Calmon F., Leduc P..  2012.  Effects of silicon substrate coupling phenomena on signal integrity for RF or high speed communications in 3D-IC. Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd.
2011
Roullard J., Capraro S., Eid E, Cadix L., Bermond C., Lacrevaz T., Farcy A., Flechet B..  2011.  Quality factor and frequency bandwidth of 2D self-inductors in 3D integration stacks. Microelectronic Engineering. 88:734-738.
2010
Eid E, Lacrevaz T., Bermond C., De Rivaz S., Capraro S., Roullard J., Cadix L., Fléchet B., Farcy A., Ancey P. et al..  2010.  Characterization and modeling of RF substrate coupling effects due to vertical interconnects in 3D integrated circuit stacking. Signal Propagation on Interconnects (SPI), 2010 IEEE 14th Workshop on.
Eid E, Lacrevaz T., Bermond C., De Rivaz S., Capraro S., Roullard J., Cadix L., Fléchet B., Farcy A., Ancey P. et al..  2010.  Characterization and Modelling of Substrate Coupling Effects in 3D Integrated Circuit Stacking. {Materials for Advanced Metallization}.
Eid E, Lacrevaz T., Bermond C., Capraro S., Roullard J., Fléchet B., Cadix L., Farcy A., Ancey P., Calmon F. et al..  2010.  Frequency and time domain characterization of substrate coupling effects in 3D integration stack. Electronic Manufacturing Technology Symposium (IEMT), 2010 34th IEEE/CPMT International.