TitleCharacterization and Modelling of Substrate Coupling Effects in 3D Integrated Circuit Stacking
Publication TypeConference Paper
Year of Publication2010
AuthorsEid E, Lacrevaz T., Bermond C., De Rivaz S., Capraro S., Roullard J., Cadix L., Fléchet B., Farcy A., Ancey P., Calmon F., Valorge O., Leduc P.
Conference Name{Materials for Advanced Metallization}
Conference LocationMechelen, Belgium
URLhttps://hal.archives-ouvertes.fr/hal-00604323